Encapsulation structures of organic electroluminescence devices

US8350470B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Donald S. Farquhar · Niskayuna, US
• Ahmet Gun Erlat · Clifton Park, US
• Christian Maria Anton Heller · Albany, US
• Anil Raj Duggal · Niskayuna, US

Key dates

• Filing date: Dec 17, 2008
• Grant date: Jan 8, 2013
• Expiry date: Jul 22, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K50/88

Abstract

An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.