Patent · US Active

Method for producing porous microneedles and their use

US8354033B2 · kind B2 · utility

9Cited by
1References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 27, 2007
Grant dateJan 15, 2013
Priority date
Expiry dateSep 19, 2029

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2201/0115
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A method for producing porous microneedles (10) situated in an array on a silicon substrate includes: providing a silicon substrate, applying a first etching mask, patterning microneedles using a DRIE process (“deep reactive ion etching”), removing the first etching mask, at least partially porosifying the Si substrate, the porosification beginning on the front side of the Si substrate and a porous reservoir being formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.