Method for producing porous microneedles and their use
US8354033B2 · kind B2 · utility
9Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2007 |
| Grant date | Jan 15, 2013 |
| Priority date | — |
| Expiry date | Sep 19, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0115
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for producing porous microneedles (10) situated in an array on a silicon substrate includes: providing a silicon substrate, applying a first etching mask, patterning microneedles using a DRIE process (“deep reactive ion etching”), removing the first etching mask, at least partially porosifying the Si substrate, the porosification beginning on the front side of the Si substrate and a porous reservoir being formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.