Forming an electrode having reduced corrosion and water decomposition on surface using an organic protective layer
US8354336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2010 |
| Grant date | Jan 15, 2013 |
| Priority date | — |
| Expiry date | Jun 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/761
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Accordingly, the present invention provides a method of forming an electrode having reduced corrosion and water decomposition on a surface thereof. A substrate which has a conductive layer disposed thereon is provided and the conductive layer has an oxide layer with an exposed surface. The exposed surface of the oxide layer contacts a solution of an organic surface active compound in an organic solvent to form a protective layer of the organic surface active compound over the oxide layer. The protective layer has a thickness of from about 0.5 nm to about 5 nm and ranges therebetween depending on a chemical structure of the surface active compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.