Image sensor and method for manufacturing an image sensor
US8354700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2009 |
| Grant date | Jan 15, 2013 |
| Priority date | — |
| Expiry date | Nov 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2209/045
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An image sensor and a method for manufacturing an image sensor are described in which the image sensor includes at least one substrate having a plurality of light-sensitive elements forming a sensor field and first microfilter elements for wavelength-selective filtering of incident light. The first microfilter elements are attached to a transparent carrier made of glass or a transparent film, for example. A first microfilter element is situated in front of a portion of the light-sensitive elements for wavelength-selective filtering of light striking the light-sensitive element. No microfilter element is situated in front of a further portion of the light-sensitive elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.