Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
US8354962B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 27, 2006 |
| Grant date | Jan 15, 2013 |
| Priority date | — |
| Expiry date | Feb 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An antenna includes a first substrate, a first pattern, a second substrate, a second pattern, and an anisotropic conductive material. The first substrate has an insulating surface. The first pattern is formed over the insulating surface of the first substrate, and made of a conductive material. The second substrate is provided so as to face the surface over which the first pattern of the first substrate is formed and has an insulating surface. The second pattern is formed over the insulating surface facing the first substrate of the second substrate, and made of a conductive material. The anisotropic conductive material electrically connects the first pattern and the second pattern. The whole region of the first pattern overlaps with the second pattern with the anisotropic conductive material interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.