Fusing device including resistive heating layer and image forming apparatus including the fusing device
US8355661B2 · kind B2 · utility
1Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2010 |
| Grant date | Jan 15, 2013 |
| Priority date | — |
| Expiry date | May 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.