Patent · US Expired

Transparent moulding compound

US8357455B2 · kind B2 · utility

3Cited by

33References

29Claims

0Family size

Assignee

EVONIK DEGUSSA GMBH · DE

Inventors

Franz-Erich Baumann · Schneverdingen, DE
Roland Wursche · Schneverdingen, DE
Harald Häger · Marienheide, DE
Sonja Bollmann · Haltern am See, DE
Kirsten Alting · Hachenburg, DE

Key dates

Filing date	Nov 9, 2005
Grant date	Jan 22, 2013
Priority date	—
Expiry date	May 7, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31725
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.