Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8357753B2 · kind B2 · utility
0Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2008 |
| Grant date | Jan 22, 2013 |
| Priority date | — |
| Expiry date | Aug 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1126
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.