LED package and back light unit using the same
US8360593B2 · kind B2 · utility
16Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2008 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jun 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
Abstract
Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.