Adhesive chuck, and apparatus and method for assembling substrates using the same
US8361267B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2011 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Mar 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.