Method and apparatus for cleaning a target of a sputtering apparatus
US8361283B2 · kind B2 · utility
0Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2005 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jul 23, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The arrangement and method for sputtering material onto a workpiece and cleaning a target of the sputtering chamber includes exposing a target to an electromagnetic field of a strength sufficient to remove particles from the target. The electromagnetic field is generated by an electromagnetic device that is positioned in proximity to the target and generates a strength greater than a strength of a cathode magnetic field behind the target to safely remove the contaminating particulates from the target, which may be made of a strong magnetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.