Forming mold or electroforming mother die having release layer and method for manufacturing the same
US8361375B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2012 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jan 5, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/22
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A forming mold or electroforming mother die including a mold or mother die, and a release layer composed of an organic thin film on a mold surface or mother die surface which is formed by contacting the mold or mother die with an organic solvent solution including a silane surfactant represented by formula [1]Rn—Si—X4-n [1]where R represents an optionally substituted hydrocarbon group or halogenated hydrocarbon having 1 to 20 carbon atoms, or a hydrocarbon group or a halogenated hydrocarbon group having a linking group which has 1 to 20 carbon atoms, X represents a hydroxyl group, a halogen atom, an alkoxy group having 1 to 6 carbon atoms, or an acyloxy group, and n represents an integer of 1 to 3; and a catalyst capable of interacting with the silane surfactant, and a production method thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.