Curable composition
US8362148B2 · kind B2 · utility
14Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2008 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Sep 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a curable composition comprising: The curable resin composition can be used for curable coatings per se and in specific for stereolithography and other applications such as three dimensional printing applications where a 3D object is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.