Prepreg with carrier and process for manufacturing same, multi-layered printed wiring board and semiconductor device
US8362363B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 2008 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Aug 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.