Circuit board, its manufacturing method, and joint box using circuit board
US8362366B2 · kind B2 · utility
0Cited by
27References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2011 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Mar 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.