Method and apparatus for an improved filled via
US8362368B2 · kind B2 · utility
0Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2010 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Mar 17, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.