Optical module package unit
US8362496B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2011 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Nov 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optical module package unit includes a light-emitting chip and a light sensor chip respectively installed in a light-emitting zone and a light-sensing zone on a substrate, a lid of plastic shell integrally formed on the substrate and defining therein a first cavity and a second cavity around the light-emitting chip and the light sensor chip respectively, and two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively. As the light-emitting chip and the light sensor chip are integrally packaged on the substrate, the packaging cost of the optical module is significantly lowered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.