Light emitting diode component
US8362695B2 · kind B2 · utility
41Cited by
49References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Apr 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.