Passive, low-profile heat transferring system
US8363411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2011 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Apr 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.