Semiconductor optical interconnection device and semiconductor optical interconnection method
US8363989B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2009 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Dec 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor optical interconnection device capable of transmitting signals between laminated semiconductor chips in a structure where semiconductor chips highly functionalized by being bonded to an optical interconnection chip are laminated. The semiconductor optical interconnection device includes a semiconductor chip 1 and an optical interconnection chip 2. The optical interconnection chip 2 includes an optical element formed thereon (for instance, a photo-sensitive element, a luminous element, or an optical modulator) which has a function relating to signal conversion between light and electricity. The semiconductor chip 1 includes a transmission section 3 (for instance, a coil or an inductor) to transmit signals in a non-contact manner, and a connection section 4 (for instance, a bump) to electrically connect with the optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.