Sub-micron planar lightwave devices formed on an SOI optical platform
US8363995B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Mar 8, 2011 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Mar 8, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A set of planar, two-dimensional optical devices is able to be created in a sub-micron surface layer of an SOI structure, or within a sub-micron thick combination of an SOI surface layer and an overlying polysilicon layer. Conventional masking/etching techniques may be used to form a variety of passive and optical devices in this SOI platform. Various regions of the devices may be doped to form the active device structures. Additionally, the polysilicon layer may be separately patterned to provide a region of effective mode index change for a propagating optical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.