Lead assembly for implantable microstimulator
US8364278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2003 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jan 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lead assembly for a small implantable medical device connects a remote electrode to a microdevice and inhibits fluid ingress into the connection. Microdevices may provide either or both tissue stimulation and sensing. Known microdevices include spaced apart electrodes on the outer surface of the microdevice. The lead assembly includes an insulated lead including a proximal end and a distal end, with at least one conductor therebetween; at least one electrode at the distal end of the lead and electrically connected to the at least one conductor, and a connector attached to the proximal end of the lead and adapted to be removably connectable to the microdevice. The connector includes at least one contact to electrically connect at least one device electrode on the microdevice to the at least one conductor. The lead assembly is configured to inhibit fluid ingress into the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.