Mark arrangement inspecting method, mask data, and manufacturing method of semiconductor device
US8364437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2009 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Oct 8, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7046
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of inspecting a mark arrangement according to an embodiment of the present invention includes: generating mask data in which mark seed data that includes an inspection mark that includes vector information and is not drawn on a mask and mark data is arranged on a scribe line of the mask, calculating coordinates of the inspection mark from a reference position of the mark seed data, detecting an arrangement state of the inspection mark with respect to the reference position by using the coordinates and vector information, and judging whether the mark seed data is correctly arranged by comparing the arrangement state of the inspection mark with an arrangement check rule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.