Method for producing a circuit board comprising a lead frame
US8365397B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2008 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Jan 11, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sub-component circuit board may be electrically and mechanically connected to a higher order circuit board using one or more leads extending from a lead frame embedded in the sub-component circuit board. The sub-component board is produced as a layered assembly with the embedded lead frame at the core. One or more dielectric layers and one or more circuitry layers are provided over the lead frame and then bonded using heat and pressure. Apertures in the dielectric and circuitry layers define a perimeter of the circuit board where the leads of the lead frame are exposed. The lead frame connects to the circuitry layer(s) using plated vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.