Plating apparatus with direct electrolyte distribution system
US8366884B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2008 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating apparatus with direct electrolyte distribution system, including one or more of the following: an electrolyte tank; an electrolyte distribution compartment within the electrolyte tank, the electrolyte distribution compartment for containing electrolyte, the electrolyte distribution compartment having a first side and a second side; a pump having a fluid connection to the electrolyte distribution compartment for applying pressure to the electrolyte; a plurality of nozzles connected to the first side of the electrolyte distribution compartment, the electrolyte being forced through the plurality of the nozzles from the electrolyte distribution compartment to a part to be plated when the pump applies pressure to the electrolyte in the electrolyte distribution compartment; an electrolyte collection compartment within the electrolyte tank, the electrolyte collection compartment being in fluid communication with the electrolyte distribution compartment; and a removable screen between the electrolyte collection compartment and the second side of the electrolyte distribution compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.