Semiconductor device and manufacturing method thereof
US8367479B2 · kind B2 · utility
9Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2010 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Dec 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.