Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
US8367522B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2011 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | May 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a monolithic integrated electronic device using edge bond pads as well as the resulting device. The method includes providing a substrate having a surface region and forming one or more integrated micro electro-mechanical systems and electronic devices on a first region overlying the surface region. One or more trench structures can be formed within one or more portions of the first region. A passivation material and a conduction material can be formed overlying the first region and the one or more trench structures. The passivation material and the conduction material can be etched to form one or more bonding pad structure. The resulting device can then be singulated within a vicinity of the one or more bond pad structures to form two or more integrated micro electro-mechanical systems and electronic devices having edge bond pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.