Light emitting diode package and method of manufacturing the same
US8368097B2 · kind B2 · utility
4Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2007 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Feb 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.