Method for embedding a component in a base
US8368201B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 18, 2011 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. Through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.