Adhesive flexible barrier film, method of forming same, and organic electronic device including same
US8368218B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2010 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Jan 25, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.