RFID tag, method of manufacturing the RFID tag, and method of mounting the RFID tag
US8368512B2 · kind B2 · utility
1Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2007 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Oct 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q13/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An RFID tag is characterized in that it includes: a dielectric substrate; a ground conductor portion disposed on one main surface of this dielectric substrate; a patch conductor portion disposed on another main surface of the above-mentioned dielectric substrate and forming a slot; electrical connecting portions internally extending from opposing sides of the above-mentioned slot, respectively; and an IC chip placed in the above-mentioned slot and connected to the above-mentioned electrical connecting portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.