Monitoring compression of successive layers of landfill material and measurement of layer density
US8370067B2 · kind B2 · utility
6Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2005 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Aug 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/13
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and system and the use of a 3-D positioning system for monitoring a landfill and landfill material added thereto and undergoing compaction and measures in real time the relative density of the compressed landfill material. The method and system calculates thickness, volume, density during the landfill operation to ensure that the landfill is comprised of compacted layers of substantially optimized density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.