Substrate having protection layers for liquid-ejection head, liquid ejection head, method for manufacturing substrate for liquid-ejection head, and method for manufacturing liquid ejection head
US8371680B2 · kind B2 · utility
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5References
15Claims
0Family size
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Key dates
| Filing date | Dec 15, 2010 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | May 23, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1646
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
When an insulating layer is provided in order to protect an energy generating element, there arises a possibility that the layer dissolves in a contacting liquid. Therefore, in order to eject liquid, a first protection layer containing metal is provided on the insulating layer facing a substrate for a liquid-ejection head and a second protection layer containing metal is provided on the surface of a liquid supply port to which a base containing silicon is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.