Thermal analysis device
US8371746B2 · kind B2 · utility
4Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2010 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Oct 27, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/486
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal analysis device comprising a replaceable sensor that can be contacted via a contact element of an electrical contacting means, a heating element and a cooling element. The contact element(s) is thermally connected with the heating element and can be heated essentially independently of the operating state of the cooling element even when no sensor is mounted to the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.