Chemical-mechanical polishing composition comprising metal-organic framework materials
US8372305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2008 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Aug 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to compositions for chemical-mechanical polishing comprising A 0.01% to 40% by weight based on the total amount of the composition of abrasive particles of at least one porous metal-organic framework material, wherein the framework material comprises at least one at least bidentate organic compound which is coordinately bound to at least one metal ion; B 40% to 99.8% by weight based on the total amount of the composition of a liquid carrier; and C 0.01% to 20% by weight based on the total amount of the composition of a polishing additive component. The invention further relates to the use of said composition as well as methods for chemical-mechanical polishing of a surface with the aid of said compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.