Methods and applications of non-planar imaging arrays
US8372726B2 · kind B2 · utility
119Cited by
206References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2010 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.