Method and apparatus to prevent stent damage caused by laser cutting
US8373090B2 · kind B2 · utility
8Cited by
8References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 4, 2009 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Aug 21, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/748
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus, method and system for cutting a polymeric stent including the use of a polymeric mandrel as a laser shielding device. The polymeric mandrel is allowed to roll freely within a polymeric tube that is cut into a polymeric stent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.