LED package for uniform color emission

US8373183B2 · kind B2 · utility

Assignee

• Hong Kong Applied Science and Technology Research Institute Company Limited · CN

Inventors

• Shan Wan · Plymouth, US
• Chang Shu Lee · Kaohsiung, TW
• Ming Lu · Shanghai, CN

Key dates

• Filing date: Feb 22, 2011
• Grant date: Feb 12, 2013
• Expiry date: Mar 27, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K50/844

Abstract

A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.