Semiconductor device
US8373251B2 · kind B2 · utility
3Cited by
3References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 10, 2010 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Mar 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first semiconductor chip includes a first inductor and a second inductor, and a second semiconductor chip includes a third inductor and a fourth inductor. The first inductor is connected to a first receiving circuit of the first semiconductor chip, and the second inductor is connected to a second transmitting circuit of the second semiconductor chip through a first bonding wire. The third inductor is connected to a second receiving circuit of the second semiconductor chip, and the fourth inductor is connected to a first transmitting circuit of the first semiconductor chip through a second bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.