Optical connection through single assembly overhang flip chip optics die with micro structure alignment
US8373259B2 · kind B2 · utility
21Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2010 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.