Source driver, method for manufacturing same, and liquid crystal module
US8373262B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 27, 2008 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Aug 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A source driver of a film package type including a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals; sprocket portions at opposite ends of the film substrate; and a heat conducting patterns for connecting the third terminals. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.