Patent · US Active

Semiconductor package with integrated interference shielding and method of manufacture thereof

US8373264B2 · kind B2 · utility

40Cited by

4References

17Claims

0Family size

Assignee

Skyworks Solutions, Inc. · US

Inventors

Patrick Lawrence Welch · Campbell, US
Yifan Guo · Lo Wu, CN

Key dates

Filing date	Dec 2, 2010
Grant date	Feb 12, 2013
Priority date	—
Expiry date	Dec 2, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.