High transmission loss headphone cushion
US8374373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2008 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Jun 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/1008
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.