Package for an implantable neural stimulation device
US8374698B2 · kind B2 · utility
50Cited by
18References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2007 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Aug 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.