Contactless IC label
US8376236B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 13, 2009 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Nov 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.