Thermal inkjet printhead chip structure and manufacturing method for the same
US8376524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2008 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Nov 26, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1642
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.