Method of manufacturing a light emitting unit and light emitting device manufactured using the method
US8376590B2 · kind B2 · utility
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14Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 28, 2010 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Sep 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of manufacturing a light emitting unit including mounting at least one light emitting element on a printed circuit board (PCB), connecting at least one terminal to the PCB, the at least one terminal to provide power to the at least one light emitting element, and molding a housing to enclose a light emitting part including the PCB and the at least one terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.