Patent · US Active

Luminescent component and manufacturing method

US8376801B2 · kind B2 · utility

0Cited by

9References

11Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Viet Nguyen Hoang · Leuven, BE
Radu Surdeanu · Roosbeek, BE
Benoit Bataillou · Evergem, BE

Key dates

Filing date	Mar 9, 2009
Grant date	Feb 19, 2013
Priority date	—
Expiry date	Mar 9, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24331
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The present invention relates to a luminescent component (30) and a manufacturing method thereof. The luminescent component (30) comprises a first transparent carrier (18), a second transparent carrier (24), a substrate (10) sandwiched between said transparent carriers (18; 24), the substrate (10) comprising a conduit from the first transparent layer (18) to the second transparent carrier (24), the conduit being filled with a luminescent solution (20). This facilitates the use of colloidal solutions of quantum dots in such a luminescent component (30). Preferably, the substrate (10) is direct bonded to the transparent carriers (18, 24) using direct wafer bonding techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.