Synthetic grinding stone
US8377159B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 25, 2008 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Jan 20, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A synthetic grinding stone used for the polishing of a silicon wafer is composed of a structure containing cerium oxide fine particles as abrasive grains, a resin as a binder, a salt as a filler and a nano diamond as an additive. This synthetic grinding stone is characterized in that the purity of the cerium oxide is not less than 60% by weight, the content of the salt as a filler is not less than 1% but not more than 20%, the volume content of the nano diamond as an additive is not less than 0.1% but less than 20% relative to the total volume of the structure, and the porosity as the volume fraction relative to the total volume of the structure is less than 30%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.