Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input
US8377245B2 · kind B2 · utility
4Cited by
5References
6Claims
0Family size
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Key dates
| Filing date | Nov 3, 2011 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Nov 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material, the particles of the expansion material being at least partially encapsulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.