Patent · US Active

Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input

US8377245B2 · kind B2 · utility

4Cited by
5References
6Claims
0Family size

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Key dates

Filing dateNov 3, 2011
Grant dateFeb 19, 2013
Priority date
Expiry dateNov 3, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31605
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material, the particles of the expansion material being at least partially encapsulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.